San Francisco, September 7:슬롯 머신 사이트 추천As chip packaging gets more advanced, Intel has said it aspires to put a trillion transistors in a package by 2030 with his next-generation chip packaging technology. Intel has led the industry in advanced packaging for a couple of decades.슬롯 머신 사이트 추천 Its innovations include EMIB (embedded multi-die interconnect bridge) and Foveros, technologies that allow multiple chips on a package to be connected side by side (EMIB) or stacked on top of one another in a 3D fashion (Foveros).
슬롯사이트œAs Moore's Law has been progressing, traditional scaling has been slowing down,슬롯사이트� said Ann Kelleher, executive vice president and general manager of Intel슬롯사이트™s Technology Development.슬롯 머신 사이트 추천슬롯사이트œBut as we start doing advanced packaging and heterogeneous integration, it means we can pack a lot more components into a given package and a given product,슬롯사이트� Kelleher said in a statement.슬롯 머신 사이트 추천Xiaomi 14 Series Launch Date: Xiaomi May Unveil 14 Series in China Before November 11, Here Are Expected Specs and Other Details.
Intel슬롯사이트™s packaging technology is also a competitive advantage for Intel Foundry Services (IFS). 슬롯사이트œFrom our Foundry customers, the feedback is, one, that we're a trusted technology company that has a proven track record in both of standard packaging and advanced packaging,슬롯사이트� said Mark Gardner, senior director of Foundry Advanced Packaging with IFS.슬롯 머신 사이트 추천iPhone 15 Launch: Apple May Introduce USB-C Charging Port on iPhone 15 Series and Replace Lightning Cable, Says Report.
슬롯사이트œAnd because we have such scale, we have a capacity and a geographic footprint that makes us much more diverse than some of the suppliers they work with today,슬롯사이트� Gardner added. Once given little attention in chipmaking, packages are changing how chips are designed and created 슬롯사이트� and, ultimately, what chips can do, according to the chip major. 슬롯사이트�슬롯사이트œThe world슬롯사이트™s most intricate and high-tech package is one you likely never see,슬롯사이트� said the company.
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